T-shape slotted array antenna through via for triple band applications

• Main Authors: Tumari, N. F., Jamlos, M. F., Lago, H., Rahim, S. K. A.
• Format: Conference or Workshop Item
• Published: Institute of Electrical and Electronics Engineers Inc. 2016
• Subjects: TK Electrical engineering. Electronics Nuclear engineering
• Online Access: http://eprints.utm.my/id/eprint/73025/; https://www.scopus.com/inward/record.uri?eid=2-s2.0-84995460797&doi=10.1109%2fRFM.2015.7587722&partnerID=40&md5=68fa5f1ba783f79114f88d82d729c25e

In this paper, T-shape slotted array antenna through via for triple band is presented. The antenna consists of 2 × 2 slotted patch antennas on the upper side of the substrate, transmission line is located at the underside of the substrate, and full ground plane as a reflector at the bottom of the transmission line with an optimum gap. The transmission line and radiating patch is connected through via. Slotted patch and position of via is applied and optimized to generate multiple bands at 1.8Ghz, 2.4GHz, and 2.6 GHz at the same time producing high gain. The dimension of each patch antenna is 36 mm × 36 mm respectively. In the simulation, result shows that the presented antenna obtained 9.058 dBi at 1.8 GHz, 7.574 dBi at 2.4 GHz and 7.313 dBi at 2.6 GHz, which are best be applied for triple bands applications.