Spot size converter using mask-Transfer self-written waveguide method for optical interconnection
For the future of optical interconnect, the spot size converter (SSC) device is anticipated to be useful. Hence, we propose SSC using mask-Transfer self-written (MTSW) method with UV-curable resin. Mask-Transfer provides easy and fast fabrication concept. This makes these technology is a promising t...
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Institute of Electrical and Electronics Engineers Inc.
2016
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my.utm.729142017-11-20T08:33:48Z http://eprints.utm.my/id/eprint/72914/ Spot size converter using mask-Transfer self-written waveguide method for optical interconnection Baharudin, N. A. Ambran, S. Mikami, O. Fujikawa, C. Suzuki, A. Taguchi, S. Mitomi, O. T Technology (General) For the future of optical interconnect, the spot size converter (SSC) device is anticipated to be useful. Hence, we propose SSC using mask-Transfer self-written (MTSW) method with UV-curable resin. Mask-Transfer provides easy and fast fabrication concept. This makes these technology is a promising technology for SSC device. A prototype fabrication of tapered SSC shape was successfully fabricated due to diffraction effect. From beam propagation method (BPM) simulation, the graph shows that radiation loss decrease as SSC length increase. Comparison between simulation and actual fabricated result shows acceptable value around 0.1-0.2 dB. Thus, these approach is reliable and has potential in the future of optical interconnection. Institute of Electrical and Electronics Engineers Inc. 2016 Conference or Workshop Item PeerReviewed Baharudin, N. A. and Ambran, S. and Mikami, O. and Fujikawa, C. and Suzuki, A. and Taguchi, S. and Mitomi, O. (2016) Spot size converter using mask-Transfer self-written waveguide method for optical interconnection. In: 2016 IEEE CPMT Symposium Japan, ICSJ 2016; Kyoto; Japan, 7 November 2016 through 9 November 2016, Kyoto; Japan. https://www.scopus.com/inward/record.uri?eid=2-s2.0-85010686482&doi=10.1109%2fICSJ.2016.7801315&partnerID=40&md5=41b5e59ddcc635a8bd054a705853a749 |
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T Technology (General) Baharudin, N. A. Ambran, S. Mikami, O. Fujikawa, C. Suzuki, A. Taguchi, S. Mitomi, O. Spot size converter using mask-Transfer self-written waveguide method for optical interconnection |
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For the future of optical interconnect, the spot size converter (SSC) device is anticipated to be useful. Hence, we propose SSC using mask-Transfer self-written (MTSW) method with UV-curable resin. Mask-Transfer provides easy and fast fabrication concept. This makes these technology is a promising technology for SSC device. A prototype fabrication of tapered SSC shape was successfully fabricated due to diffraction effect. From beam propagation method (BPM) simulation, the graph shows that radiation loss decrease as SSC length increase. Comparison between simulation and actual fabricated result shows acceptable value around 0.1-0.2 dB. Thus, these approach is reliable and has potential in the future of optical interconnection. |
format |
Conference or Workshop Item |
author |
Baharudin, N. A. Ambran, S. Mikami, O. Fujikawa, C. Suzuki, A. Taguchi, S. Mitomi, O. |
author_facet |
Baharudin, N. A. Ambran, S. Mikami, O. Fujikawa, C. Suzuki, A. Taguchi, S. Mitomi, O. |
author_sort |
Baharudin, N. A. |
title |
Spot size converter using mask-Transfer self-written waveguide method for optical interconnection |
title_short |
Spot size converter using mask-Transfer self-written waveguide method for optical interconnection |
title_full |
Spot size converter using mask-Transfer self-written waveguide method for optical interconnection |
title_fullStr |
Spot size converter using mask-Transfer self-written waveguide method for optical interconnection |
title_full_unstemmed |
Spot size converter using mask-Transfer self-written waveguide method for optical interconnection |
title_sort |
spot size converter using mask-transfer self-written waveguide method for optical interconnection |
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Institute of Electrical and Electronics Engineers Inc. |
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2016 |
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http://eprints.utm.my/id/eprint/72914/ https://www.scopus.com/inward/record.uri?eid=2-s2.0-85010686482&doi=10.1109%2fICSJ.2016.7801315&partnerID=40&md5=41b5e59ddcc635a8bd054a705853a749 |
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13.18916 |