Substrate Warpage analysis During Solger Reflow Process
Organic substrate is a composite panel consists of several materials such as BT core, copper, dielectric, solder resist and plugging material. As different material has different material property, when the organic substrate is exposed to thermal excursion in the manufacturing process, the substr...
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| Format: | Thesis |
| Published: |
2004
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| Online Access: | http://eprints.utm.my/id/eprint/6938/ http://sps.utm.my |
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