An experimental investigation on partial-ductile mode grinding of silicon

• Main Author: Konneh, M.
• Format: Thesis
• Language: English
• Published: 2002
• Subjects: TJ Mechanical engineering and machinery
• Online Access: http://eprints.utm.my/id/eprint/6867/1/MohamedKonnehPFKM2002_AnExperimentalInvestigationonPartial-DuctileModeGrinding.pdf; http://eprints.utm.my/id/eprint/6867/; http://dms.library.utm.my:8080/vital/access/manager/Repository/vital:61201?queryType=vitalDismax&query=An+experimental+investigation+on+partial-ductile+mode+grinding+of+silicon+&public=true

This research work was primarily concentrated on precise ductile-mode grinding (milling) of flat surfaces of silicon, mainly Integrated Circuit (IC) silicon chips (dies), which were about 700 µm thick and the top of their surfaces covered with a silicon nitride layer. Substantial amount of partial-...