Transparent microwave crossover for transparent Butler matrix using micro-metal mesh conductive film

This paper presents the design of a novel transparent microwave crossover (MC) for a transparent Butler matrix (BM) using a proprietary self-assembling nano-particle technology based Micro-metal Mesh (MM) conductive film. The transparent MM conductive film has a sheet resistance of 0.7 ohms/sq and a...

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Main Authors: Sa'Ad, B. M., Rahim, S. K. A., Peter, T., Abedian, M., Danesh, S.
Format: Conference or Workshop Item
Language:English
Published: 2015
Subjects:
Online Access:http://eprints.utm.my/id/eprint/59531/1/BMSa%27ad2015_TransparentMicrowaveCrossover.pdf
http://eprints.utm.my/id/eprint/59531/
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spelling my.utm.595312022-03-02T03:33:20Z http://eprints.utm.my/id/eprint/59531/ Transparent microwave crossover for transparent Butler matrix using micro-metal mesh conductive film Sa'Ad, B. M. Rahim, S. K. A. Peter, T. Abedian, M. Danesh, S. TK Electrical engineering. Electronics Nuclear engineering This paper presents the design of a novel transparent microwave crossover (MC) for a transparent Butler matrix (BM) using a proprietary self-assembling nano-particle technology based Micro-metal Mesh (MM) conductive film. The transparent MM conductive film has a sheet resistance of 0.7 ohms/sq and a visible-light transmission of 75 %, resulting in high transparency and good conductivity, respectively. The proposed transparent crossover is placed on a 2 mm-thick glass substrate of dielectric 5.7 and designed to operate at 2.45 GHz. A layer of MM film placed at the back of the glass serves as a ground. The transparent MC delivered a measured crossing coupling of 1.5 dB. The transparent MC can be used as a building block for realizing a transparent Butler Matrix (BM) Beam Forming Network (BFN) for inter/intra-vehicle wireless communication (IIVWC) in Intelligent Transport System (ITS). Besides being transparent, the proposed MC has a 0.25 mm profile excluding the glass substrate. These advantages greatly enhance the MC's potential to be used also as a BM building component that can be mounted onto the glass surfaces of buildings for future 5G indoor wireless communications. 2015 Conference or Workshop Item PeerReviewed application/pdf en http://eprints.utm.my/id/eprint/59531/1/BMSa%27ad2015_TransparentMicrowaveCrossover.pdf Sa'Ad, B. M. and Rahim, S. K. A. and Peter, T. and Abedian, M. and Danesh, S. (2015) Transparent microwave crossover for transparent Butler matrix using micro-metal mesh conductive film. In: 9th European Conference on Antennas and Propagation, EuCAP 2015, 13-17 May 2015, Lisbon, Portugal.
institution Universiti Teknologi Malaysia
building UTM Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Teknologi Malaysia
content_source UTM Institutional Repository
url_provider http://eprints.utm.my/
language English
topic TK Electrical engineering. Electronics Nuclear engineering
spellingShingle TK Electrical engineering. Electronics Nuclear engineering
Sa'Ad, B. M.
Rahim, S. K. A.
Peter, T.
Abedian, M.
Danesh, S.
Transparent microwave crossover for transparent Butler matrix using micro-metal mesh conductive film
description This paper presents the design of a novel transparent microwave crossover (MC) for a transparent Butler matrix (BM) using a proprietary self-assembling nano-particle technology based Micro-metal Mesh (MM) conductive film. The transparent MM conductive film has a sheet resistance of 0.7 ohms/sq and a visible-light transmission of 75 %, resulting in high transparency and good conductivity, respectively. The proposed transparent crossover is placed on a 2 mm-thick glass substrate of dielectric 5.7 and designed to operate at 2.45 GHz. A layer of MM film placed at the back of the glass serves as a ground. The transparent MC delivered a measured crossing coupling of 1.5 dB. The transparent MC can be used as a building block for realizing a transparent Butler Matrix (BM) Beam Forming Network (BFN) for inter/intra-vehicle wireless communication (IIVWC) in Intelligent Transport System (ITS). Besides being transparent, the proposed MC has a 0.25 mm profile excluding the glass substrate. These advantages greatly enhance the MC's potential to be used also as a BM building component that can be mounted onto the glass surfaces of buildings for future 5G indoor wireless communications.
format Conference or Workshop Item
author Sa'Ad, B. M.
Rahim, S. K. A.
Peter, T.
Abedian, M.
Danesh, S.
author_facet Sa'Ad, B. M.
Rahim, S. K. A.
Peter, T.
Abedian, M.
Danesh, S.
author_sort Sa'Ad, B. M.
title Transparent microwave crossover for transparent Butler matrix using micro-metal mesh conductive film
title_short Transparent microwave crossover for transparent Butler matrix using micro-metal mesh conductive film
title_full Transparent microwave crossover for transparent Butler matrix using micro-metal mesh conductive film
title_fullStr Transparent microwave crossover for transparent Butler matrix using micro-metal mesh conductive film
title_full_unstemmed Transparent microwave crossover for transparent Butler matrix using micro-metal mesh conductive film
title_sort transparent microwave crossover for transparent butler matrix using micro-metal mesh conductive film
publishDate 2015
url http://eprints.utm.my/id/eprint/59531/1/BMSa%27ad2015_TransparentMicrowaveCrossover.pdf
http://eprints.utm.my/id/eprint/59531/
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score 13.160551