Effect of environmental condition and nickel underlayer on whiskers formation in tin surface finish
The ban on lead in electronic industry caused manufacturers to search for alternative ways to replace lead without affecting the performance of electronic products. Among lead-free alternative surface finishes, pure tin plating has attracted greater attention as potential candidate to replace hot ai...
Saved in:
| Main Author: | |
|---|---|
| Format: | Thesis |
| Language: | English |
| Published: |
2014
|
| Subjects: | |
| Online Access: | http://eprints.utm.my/id/eprint/50810/25/SitiZahiraYusofMFKM2014.pdf http://eprints.utm.my/id/eprint/50810/ http://dms.library.utm.my:8080/vital/access/manager/Repository/vital:89360 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|