Nickel phosphorus coated substrate micro-defect reduction through chemical mechanical planarization process optimization

• Main Author: Mohd. Saleh, Nazim
• Format: Thesis
• Language: English
• Published: 2014
• Subjects: TJ Mechanical engineering and machinery
• Online Access: http://eprints.utm.my/id/eprint/50778/25/NazimMohdSalehMFKM2014.pdf; http://eprints.utm.my/id/eprint/50778/; http://dms.library.utm.my:8080/vital/access/manager/Repository/vital:85653

Chemical mechanical planarization (CMP) was known as a process to gain superfine surface finish with high precision mechanical parameters. It widely used within semiconductors wafer manufacturing and hard disk (HDD) industries. There’re very few research done in HDD compared with silicon wafer. Micr...