Interfacial reactions between lead-free solders and electroless nickel

Saved in:
Bibliographic Details
Main Author: Mohd. Muzamir Mahat,
Format: Thesis
Published: 2009
Subjects:
Online Access:http://eprints.utm.my/id/eprint/48107/
Tags: Add Tag
No Tags, Be the first to tag this record!
id my.utm.48107
record_format eprints
spelling my.utm.481072015-10-15T01:09:48Z http://eprints.utm.my/id/eprint/48107/ Interfacial reactions between lead-free solders and electroless nickel Mohd. Muzamir Mahat, TK Electrical engineering. Electronics Nuclear engineering 2009 Thesis NonPeerReviewed Mohd. Muzamir Mahat, (2009) Interfacial reactions between lead-free solders and electroless nickel. Masters thesis, Universiti Teknologi Malaysia, Faculty of Mechanical Engineering.
institution Universiti Teknologi Malaysia
building UTM Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Teknologi Malaysia
content_source UTM Institutional Repository
url_provider http://eprints.utm.my/
topic TK Electrical engineering. Electronics Nuclear engineering
spellingShingle TK Electrical engineering. Electronics Nuclear engineering
Mohd. Muzamir Mahat,
Interfacial reactions between lead-free solders and electroless nickel
format Thesis
author Mohd. Muzamir Mahat,
author_facet Mohd. Muzamir Mahat,
author_sort Mohd. Muzamir Mahat,
title Interfacial reactions between lead-free solders and electroless nickel
title_short Interfacial reactions between lead-free solders and electroless nickel
title_full Interfacial reactions between lead-free solders and electroless nickel
title_fullStr Interfacial reactions between lead-free solders and electroless nickel
title_full_unstemmed Interfacial reactions between lead-free solders and electroless nickel
title_sort interfacial reactions between lead-free solders and electroless nickel
publishDate 2009
url http://eprints.utm.my/id/eprint/48107/
_version_ 1643652462299578368
score 13.18916