Temperature pattern during void discharge in XLPE
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2011
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my.utm.463382015-06-10T03:01:16Z http://eprints.utm.my/id/eprint/46338/ Temperature pattern during void discharge in XLPE Nor Asiah Muhamad, 2011 Conference or Workshop Item PeerReviewed Nor Asiah Muhamad, (2011) Temperature pattern during void discharge in XLPE. In: International Conference On Advanced Electromaterials (ICAE 2011). |
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Universiti Teknologi Malaysia |
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UTM Library |
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Institutional Repository |
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Asia |
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Malaysia |
| content_provider |
Universiti Teknologi Malaysia |
| content_source |
UTM Institutional Repository |
| url_provider |
http://eprints.utm.my/ |
| format |
Conference or Workshop Item |
| author |
Nor Asiah Muhamad, |
| spellingShingle |
Nor Asiah Muhamad, Temperature pattern during void discharge in XLPE |
| author_facet |
Nor Asiah Muhamad, |
| author_sort |
Nor Asiah Muhamad, |
| title |
Temperature pattern during void discharge in XLPE |
| title_short |
Temperature pattern during void discharge in XLPE |
| title_full |
Temperature pattern during void discharge in XLPE |
| title_fullStr |
Temperature pattern during void discharge in XLPE |
| title_full_unstemmed |
Temperature pattern during void discharge in XLPE |
| title_sort |
temperature pattern during void discharge in xlpe |
| publishDate |
2011 |
| url |
http://eprints.utm.my/id/eprint/46338/ |
| _version_ |
1643652005956157440 |
| score |
13.214268 |