Interfacial reactions between tin-silver-copper lead-free solders and nickel (P)/palladium/gold and nickel (B)/palladium/gold surface finishes

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Main Author: Osman, Saliza Azlina
Format: Thesis
Published: 2012
Subjects:
Online Access:http://eprints.utm.my/id/eprint/31358/
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spelling my.utm.313582013-05-07T03:15:03Z http://eprints.utm.my/id/eprint/31358/ Interfacial reactions between tin-silver-copper lead-free solders and nickel (P)/palladium/gold and nickel (B)/palladium/gold surface finishes Osman, Saliza Azlina Unspecified 2012 Thesis NonPeerReviewed Osman, Saliza Azlina (2012) Interfacial reactions between tin-silver-copper lead-free solders and nickel (P)/palladium/gold and nickel (B)/palladium/gold surface finishes. PhD thesis, Universiti Teknologi Malaysia, Faculty of Mechanical Engineering.
institution Universiti Teknologi Malaysia
building UTM Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Teknologi Malaysia
content_source UTM Institutional Repository
url_provider http://eprints.utm.my/
topic Unspecified
spellingShingle Unspecified
Osman, Saliza Azlina
Interfacial reactions between tin-silver-copper lead-free solders and nickel (P)/palladium/gold and nickel (B)/palladium/gold surface finishes
format Thesis
author Osman, Saliza Azlina
author_facet Osman, Saliza Azlina
author_sort Osman, Saliza Azlina
title Interfacial reactions between tin-silver-copper lead-free solders and nickel (P)/palladium/gold and nickel (B)/palladium/gold surface finishes
title_short Interfacial reactions between tin-silver-copper lead-free solders and nickel (P)/palladium/gold and nickel (B)/palladium/gold surface finishes
title_full Interfacial reactions between tin-silver-copper lead-free solders and nickel (P)/palladium/gold and nickel (B)/palladium/gold surface finishes
title_fullStr Interfacial reactions between tin-silver-copper lead-free solders and nickel (P)/palladium/gold and nickel (B)/palladium/gold surface finishes
title_full_unstemmed Interfacial reactions between tin-silver-copper lead-free solders and nickel (P)/palladium/gold and nickel (B)/palladium/gold surface finishes
title_sort interfacial reactions between tin-silver-copper lead-free solders and nickel (p)/palladium/gold and nickel (b)/palladium/gold surface finishes
publishDate 2012
url http://eprints.utm.my/id/eprint/31358/
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score 13.160551