Effect of aggregate moisture on adhesion of chip seal

• Main Author: Che Ajid, Nur Hizaruddin
• Format: Thesis
• Language: English
• Published: 2012
• Subjects: TA Engineering (General). Civil engineering (General)
• Online Access: http://eprints.utm.my/id/eprint/29841/1/NurHizaruddinAjidMFKA2012.pdf; http://eprints.utm.my/id/eprint/29841/

Chip seal involves the application of a thin layer of bituminous binder to the pavement surface followed by the spreading and rolling into it of single sized aggregates. There are several problems when using chip seal. One of the problems is moisture content on aggregate in chip seal. This will lead...