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Application of signal analysis techniques for condition monitoring of a wire-bonding machine

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Main Author: Ahmad, Putri Aidawati
Format: Thesis
Published: 2000
Subjects:
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Online Access:http://eprints.utm.my/id/eprint/28212/
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id my.utm.28212
record_format eprints
spelling my.utm.282122012-10-04T10:37:54Z http://eprints.utm.my/id/eprint/28212/ Application of signal analysis techniques for condition monitoring of a wire-bonding machine Ahmad, Putri Aidawati Unspecified 2000 Thesis NonPeerReviewed Ahmad, Putri Aidawati (2000) Application of signal analysis techniques for condition monitoring of a wire-bonding machine. Masters thesis, Universiti Teknologi Malaysia, Faculty of Electrical Engineering.
institution Universiti Teknologi Malaysia
building UTM Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Teknologi Malaysia
content_source UTM Institutional Repository
url_provider http://eprints.utm.my/
topic Unspecified
spellingShingle Unspecified
Ahmad, Putri Aidawati
Application of signal analysis techniques for condition monitoring of a wire-bonding machine
format Thesis
author Ahmad, Putri Aidawati
author_facet Ahmad, Putri Aidawati
author_sort Ahmad, Putri Aidawati
title Application of signal analysis techniques for condition monitoring of a wire-bonding machine
title_short Application of signal analysis techniques for condition monitoring of a wire-bonding machine
title_full Application of signal analysis techniques for condition monitoring of a wire-bonding machine
title_fullStr Application of signal analysis techniques for condition monitoring of a wire-bonding machine
title_full_unstemmed Application of signal analysis techniques for condition monitoring of a wire-bonding machine
title_sort application of signal analysis techniques for condition monitoring of a wire-bonding machine
publishDate 2000
url http://eprints.utm.my/id/eprint/28212/
_version_ 1643648009005694976
score 13.18916

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