Hybrid experimental-computational approach for solder/IMC interface shear strength determination in tin-lead solder joints

Damage-based models for solder/intermetallics (IMC) interface often require the interface properties such as tensile and shear strengths. The minute size of the solder joint renders direct experimental determination of these properties impractical. This paper presents a hybrid experimental-computati...

Full description

Saved in:
Bibliographic Details
Main Authors: Tamin, Mohd N., M. Nor, Fethma, Wei, Keat Loh
Format: Conference or Workshop Item
Published: 2007
Subjects:
Online Access:http://eprints.utm.my/id/eprint/14102/
http://ieeexplore.ieee.org/document/5585732/
Tags: Add Tag
No Tags, Be the first to tag this record!
id my.utm.14102
record_format eprints
spelling my.utm.141022017-06-12T07:05:21Z http://eprints.utm.my/id/eprint/14102/ Hybrid experimental-computational approach for solder/IMC interface shear strength determination in tin-lead solder joints Tamin, Mohd N. M. Nor, Fethma Wei, Keat Loh TJ Mechanical engineering and machinery Damage-based models for solder/intermetallics (IMC) interface often require the interface properties such as tensile and shear strengths. The minute size of the solder joint renders direct experimental determination of these properties impractical. This paper presents a hybrid experimental-computational approach to determine the shear strength of solder/IMC interface. Displacement-controlled ball shear tests are performed on as-reflowed and thermally-aged solder specimens. The observed sudden load drop in the load-displacement curve corresponds to the crack initiation event and the load is indicative of the shear strength of the solder/IMC interface. Finite element simulation of the ball shear test is then employed to establish the complex stress states at the interface corresponding to the onset of fracture. The finite element model consists of Sn40Pb solder, Ni3Sn4 intermetallic and Ni layers, copper pad and a rigid shear tool. Unified inelastic strain theory describes the strain rate-dependent response of the solder while other materials are assumed to behave elastically. Quasi-static ball shear test is simulated at 30°C with a prescribed displacement rate of 0.5mm/min. Results show that steep stress gradients develop in the shear tool-solder contact and solder/IMC interface regions indicating effective load transfer to the interface. The bending (normal) stress is found to be of the same order of magnitude as the maximum shear stress. Higher stress values are predicted near the leading edge of the solder/IMC interface. The equivalent shear stress condition to the triaxial stress state at the interface, represented by the absolute maximum shear stress, τmax,abs should have reached the shear strength of the interface at fracture. The resulting shear strength of Sn40Pb/Ni3Sn4 interface is determined to be 87.5 MPa. 2007 Conference or Workshop Item PeerReviewed Tamin, Mohd N. and M. Nor, Fethma and Wei, Keat Loh (2007) Hybrid experimental-computational approach for solder/IMC interface shear strength determination in tin-lead solder joints. In: International Conference on Advanced Computation Engineering Experimenting, 2007, Portugal. http://ieeexplore.ieee.org/document/5585732/
institution Universiti Teknologi Malaysia
building UTM Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Teknologi Malaysia
content_source UTM Institutional Repository
url_provider http://eprints.utm.my/
topic TJ Mechanical engineering and machinery
spellingShingle TJ Mechanical engineering and machinery
Tamin, Mohd N.
M. Nor, Fethma
Wei, Keat Loh
Hybrid experimental-computational approach for solder/IMC interface shear strength determination in tin-lead solder joints
description Damage-based models for solder/intermetallics (IMC) interface often require the interface properties such as tensile and shear strengths. The minute size of the solder joint renders direct experimental determination of these properties impractical. This paper presents a hybrid experimental-computational approach to determine the shear strength of solder/IMC interface. Displacement-controlled ball shear tests are performed on as-reflowed and thermally-aged solder specimens. The observed sudden load drop in the load-displacement curve corresponds to the crack initiation event and the load is indicative of the shear strength of the solder/IMC interface. Finite element simulation of the ball shear test is then employed to establish the complex stress states at the interface corresponding to the onset of fracture. The finite element model consists of Sn40Pb solder, Ni3Sn4 intermetallic and Ni layers, copper pad and a rigid shear tool. Unified inelastic strain theory describes the strain rate-dependent response of the solder while other materials are assumed to behave elastically. Quasi-static ball shear test is simulated at 30°C with a prescribed displacement rate of 0.5mm/min. Results show that steep stress gradients develop in the shear tool-solder contact and solder/IMC interface regions indicating effective load transfer to the interface. The bending (normal) stress is found to be of the same order of magnitude as the maximum shear stress. Higher stress values are predicted near the leading edge of the solder/IMC interface. The equivalent shear stress condition to the triaxial stress state at the interface, represented by the absolute maximum shear stress, τmax,abs should have reached the shear strength of the interface at fracture. The resulting shear strength of Sn40Pb/Ni3Sn4 interface is determined to be 87.5 MPa.
format Conference or Workshop Item
author Tamin, Mohd N.
M. Nor, Fethma
Wei, Keat Loh
author_facet Tamin, Mohd N.
M. Nor, Fethma
Wei, Keat Loh
author_sort Tamin, Mohd N.
title Hybrid experimental-computational approach for solder/IMC interface shear strength determination in tin-lead solder joints
title_short Hybrid experimental-computational approach for solder/IMC interface shear strength determination in tin-lead solder joints
title_full Hybrid experimental-computational approach for solder/IMC interface shear strength determination in tin-lead solder joints
title_fullStr Hybrid experimental-computational approach for solder/IMC interface shear strength determination in tin-lead solder joints
title_full_unstemmed Hybrid experimental-computational approach for solder/IMC interface shear strength determination in tin-lead solder joints
title_sort hybrid experimental-computational approach for solder/imc interface shear strength determination in tin-lead solder joints
publishDate 2007
url http://eprints.utm.my/id/eprint/14102/
http://ieeexplore.ieee.org/document/5585732/
_version_ 1643646327089790976
score 13.18916