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Aspect of modelling the mechanics of solder/intermetallic interface fracture process in solder interconnects

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Main Authors: Kamsah, Mohd. Nasir, Tamin, Nazri
Format: Book Section
Published: Penerbit UTM 2007
Subjects:
TJ Mechanical engineering and machinery
Online Access:http://eprints.utm.my/id/eprint/13372/
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spelling my.utm.133722017-10-05T06:07:36Z http://eprints.utm.my/id/eprint/13372/ Aspect of modelling the mechanics of solder/intermetallic interface fracture process in solder interconnects Kamsah, Mohd. Nasir Tamin, Nazri TJ Mechanical engineering and machinery Penerbit UTM 2007 Book Section PeerReviewed Kamsah, Mohd. Nasir and Tamin, Nazri (2007) Aspect of modelling the mechanics of solder/intermetallic interface fracture process in solder interconnects. In: Advances in Applied Numerical Methods. Penerbit UTM , Johor, pp. 55-76. ISBN 978-983-52-0547-7
institution Universiti Teknologi Malaysia
building UTM Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Teknologi Malaysia
content_source UTM Institutional Repository
url_provider http://eprints.utm.my/
topic TJ Mechanical engineering and machinery
spellingShingle TJ Mechanical engineering and machinery
Kamsah, Mohd. Nasir
Tamin, Nazri
Aspect of modelling the mechanics of solder/intermetallic interface fracture process in solder interconnects
format Book Section
author Kamsah, Mohd. Nasir
Tamin, Nazri
author_facet Kamsah, Mohd. Nasir
Tamin, Nazri
author_sort Kamsah, Mohd. Nasir
title Aspect of modelling the mechanics of solder/intermetallic interface fracture process in solder interconnects
title_short Aspect of modelling the mechanics of solder/intermetallic interface fracture process in solder interconnects
title_full Aspect of modelling the mechanics of solder/intermetallic interface fracture process in solder interconnects
title_fullStr Aspect of modelling the mechanics of solder/intermetallic interface fracture process in solder interconnects
title_full_unstemmed Aspect of modelling the mechanics of solder/intermetallic interface fracture process in solder interconnects
title_sort aspect of modelling the mechanics of solder/intermetallic interface fracture process in solder interconnects
publisher Penerbit UTM
publishDate 2007
url http://eprints.utm.my/id/eprint/13372/
_version_ 1643646172142764032
score 13.209306

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