Strain rate effect on mode I debonding characterization of adhesively bonded aluminum joints

• 主要な著者: Khan, Safdar Ali, Koloor, Seyed Saeid Rahimian, Wong, King Jye, Yidris, Noorfaizal, Mohd. Yusof, Ab. Aziz, Mohd. Szali Januddi, Mohd. Al Fatihhi, Tamin, Mohd. Nasir, Johar, Mahzan
• フォーマット: 論文
• 言語: English
• 出版事項: MDPI 2023
• 主題: TJ Mechanical engineering and machinery
• オンライン･アクセス: http://eprints.utm.my/106534/1/WongKingJye2023_StrainRateEffectonModeIDebonding.pdf; http://eprints.utm.my/106534/; http://dx.doi.org/10.3390/pr11010081

In adhesive bonding, two different substrate materials are joined together, usually by forming chemical bonds. The adhesive can stick things together. The loading rate and deformation mode can easily change the mechanical properties of the adhesive material. Hence, a vital aim of the current study i...