Mechanics of solder/IMC interface of lead-free solder interconnects in ball grid array assembly

• Main Authors: Asasaari, S. F. M., Fadil, N. A., Tamin, M. N.
• Format: Article
• Language: English
• Published: Universiti Malaysia Pahang Publishing 2022
• Subjects: TJ Mechanical engineering and machinery
• Online Access: http://eprints.utm.my/103420/1/MohdNasirTamin2022_MechanicsofSolderIMCInterface.pdf; http://eprints.utm.my/103420/; https://dx.doi.org/10.15282/jmes.16.1.2022.06.0689

The lead-free Sn-0.4Ag-0.5Cu (SAC405) solder arrays provides an interconnection between the electronic package and printed circuit board (PCB) of the assembly. The ball grid array (BGA) test assembly was exposed to thermo-mechanical loading during solder reflow cooling and subsequent reliability tem...