Investigating the structural transformation of individual Au-incorporated carbon nanofiber interconnect

• Main Authors: Rosmi, Mohamad Saufi, Yaakob, Yazid, Mohd. Yusop, Mohd. Zamri, Md. Isa, Illyas, Sidik, Siti Munirah, Abu Bakar, Suriani, Masaki, Tanemura
• Format: Article
• Published: Microscopy Society of Malaysia 2022
• Subjects: Q Science (General); TJ Mechanical engineering and machinery
• Online Access: http://eprints.utm.my/id/eprint/102905/; https://malaysianjournalofmicroscopy.org/ojs/index.php/mjm/article/view/621

Nowadays, a smaller electronic integrated circuit demands a smaller width and pitch of interconnect. Copper (Cu) interconnect, which is currently the most common, suffers from the size effect and grain boundary scattering. Hence, carbon materials such as carbon nanotubes (CNTs) and carbon nanofiber...