Interfacial microstructure evolution and shear strength of MWCNTs-reinforced Sn-1.0Ag-0.5Cu (SAC105) composite solder interconnects on plain Cu and ENIAg surface finish
The combined effect of MWCNTs (multi-walled carbon nanotubes) and ENIAg (Electroless Nickel Immersion Silver) surface finish on the formation of interfacial microstructure and shear strength of the Sn-1.0Ag-0.5Cu (SAC105) solder was investigated in this study. Plain and composite solders (SAC-xCN...
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| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Springer Link
2022
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| Subjects: | |
| Online Access: | http://eprints.uthm.edu.my/7099/1/J14082_28711dfb5865d2e17b8bcb627ff5ed56.pdf http://eprints.uthm.edu.my/7099/ https://doi.org/10.1007/s10854-022-07974-8 |
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