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Optimizing Electroplating Process Parameter And Sn-Plating Thickness Uniformity Using Modified Shielding

Uneven plating thickness distribution across plated surface has become a major challenge in electroplating industry even for advanced plating technology today due to complexity of package design. LPL HD package encounter low plating thickness on the heatsink area, but thicker on lead area. Due to th...

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Bibliographic Details
Main Author: Suieb, Nurhanim
Format: Thesis
Language:English
English
Published: 2020
Subjects:
T Technology (General)
TS Manufactures
Online Access:http://eprints.utem.edu.my/id/eprint/25581/2/Optimizing%20Electroplating%20Process%20Parameter%20And%20Sn-Plating%20Thickness%20Uniformity%20Using%20Modified%20Shielding.pdf
http://eprints.utem.edu.my/id/eprint/25581/3/Optimizing%20Electroplating%20Process%20Parameter%20And%20Sn-Plating%20Thickness%20Uniformity%20Using%20Modified%20Shielding.pdf
http://eprints.utem.edu.my/id/eprint/25581/
https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=119193
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http://eprints.utem.edu.my/id/eprint/25581/2/Optimizing%20Electroplating%20Process%20Parameter%20And%20Sn-Plating%20Thickness%20Uniformity%20Using%20Modified%20Shielding.pdf
http://eprints.utem.edu.my/id/eprint/25581/3/Optimizing%20Electroplating%20Process%20Parameter%20And%20Sn-Plating%20Thickness%20Uniformity%20Using%20Modified%20Shielding.pdf
http://eprints.utem.edu.my/id/eprint/25581/
https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=119193

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