Backside Chipping Improvement Of Non-Backcoated Bare Die Device For Mobile Application

This project is backside chipping improvement of non- backcoated bare die device for mobile application due to low yield performance. Analysis of this project will be use JMP software to analyze the prediction result and final result in order to improve backside chipping. Based on data analysis, if...

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Bibliographic Details
Main Author: Jamaluddin, Nurezzaty
Format: Thesis
Language:English
English
Published: 2020
Subjects:
Online Access:http://eprints.utem.edu.my/id/eprint/25572/1/Backside%20Chipping%20Improvement%20Of%20Non-Backcoated%20Bare%20Die%20Device%20For%20Mobile%20Application.pdf
http://eprints.utem.edu.my/id/eprint/25572/2/Backside%20Chipping%20Improvement%20Of%20Non-Backcoated%20Bare%20Die%20Device%20For%20Mobile%20Application.pdf
http://eprints.utem.edu.my/id/eprint/25572/
https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=119199
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