Numerical solution for crack phenomenon in dissimilar materials under various mechanical loadings
A new mathematical model is developed for the analytical study of two cracks in the upper plane of dissimilar materials under various mechanical loadings, i.e., shear, normal, tearing and mixed stresses with different geometry conditions. This problem is developed into a new mathematical model of hy...
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my.utem.eprints.255442023-07-20T16:23:34Z http://eprints.utem.edu.my/id/eprint/25544/ Numerical solution for crack phenomenon in dissimilar materials under various mechanical loadings Nik Long, Nik Mohd Asri Hamzah, Khairum Senu, Norazak Eshkuvatov, Zainiddin K. A new mathematical model is developed for the analytical study of two cracks in the upper plane of dissimilar materials under various mechanical loadings, i.e., shear, normal, tearing and mixed stresses with different geometry conditions. This problem is developed into a new mathematical model of hypersingular integral equations (HSIEs) by using the modified complex potentials (MCPs) function and the continuity conditions of the resultant force and displacement with the crack opening displacement (COD) function as the unknown. The newly obtained mathematical model of HSIEs are solved numerically by utilizing the appropriate quadrature formulas. Numerical computations and graphical demonstrations are carried out to observe the profound effect of the elastic constants ratio, mode of stresses and geometry conditions on the dimensionless stress intensity factors (SIFs) at the crack tips MDPI AG 2021-01 Article PeerReviewed text en http://eprints.utem.edu.my/id/eprint/25544/2/PUBLISH%20VERSION_SYMMETRY-13-00235_2021.PDF Nik Long, Nik Mohd Asri and Hamzah, Khairum and Senu, Norazak and Eshkuvatov, Zainiddin K. (2021) Numerical solution for crack phenomenon in dissimilar materials under various mechanical loadings. Symmetry, 13 (2). pp. 1-20. ISSN 2073-8994 https://www.mdpi.com/2073-8994/13/2/235 10.3390/SYM13020235 |
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A new mathematical model is developed for the analytical study of two cracks in the upper plane of dissimilar materials under various mechanical loadings, i.e., shear, normal, tearing and mixed stresses with different geometry conditions. This problem is developed into a new mathematical model of hypersingular integral equations (HSIEs) by using the modified complex potentials (MCPs) function and the continuity conditions of the resultant force and displacement with
the crack opening displacement (COD) function as the unknown. The newly obtained mathematical model of HSIEs are solved numerically by utilizing the appropriate quadrature formulas. Numerical computations and graphical demonstrations are carried out to observe the profound effect of the elastic constants ratio, mode of stresses and geometry conditions on the dimensionless stress intensity factors (SIFs) at the crack tips |
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Article |
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Nik Long, Nik Mohd Asri Hamzah, Khairum Senu, Norazak Eshkuvatov, Zainiddin K. |
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Nik Long, Nik Mohd Asri Hamzah, Khairum Senu, Norazak Eshkuvatov, Zainiddin K. Numerical solution for crack phenomenon in dissimilar materials under various mechanical loadings |
author_facet |
Nik Long, Nik Mohd Asri Hamzah, Khairum Senu, Norazak Eshkuvatov, Zainiddin K. |
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Nik Long, Nik Mohd Asri |
title |
Numerical solution for crack phenomenon in dissimilar materials under various mechanical loadings |
title_short |
Numerical solution for crack phenomenon in dissimilar materials under various mechanical loadings |
title_full |
Numerical solution for crack phenomenon in dissimilar materials under various mechanical loadings |
title_fullStr |
Numerical solution for crack phenomenon in dissimilar materials under various mechanical loadings |
title_full_unstemmed |
Numerical solution for crack phenomenon in dissimilar materials under various mechanical loadings |
title_sort |
numerical solution for crack phenomenon in dissimilar materials under various mechanical loadings |
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MDPI AG |
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2021 |
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http://eprints.utem.edu.my/id/eprint/25544/2/PUBLISH%20VERSION_SYMMETRY-13-00235_2021.PDF http://eprints.utem.edu.my/id/eprint/25544/ https://www.mdpi.com/2073-8994/13/2/235 |
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