Numerical solution for the thermally insulated cracks in bonded dissimilar materials using hypersingular integral equations
The new system of hypersingular integral equations (HSIEs) for the thermally insulated inclined cracks and thermally insulated circular arc cracks subjected to remote shear stress in bonded dissimilar materials was formulated by using the modified complex potentials (MCPs) function method with the...
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Elsevier Inc.
2021
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my.utem.eprints.255172023-07-20T16:26:16Z http://eprints.utem.edu.my/id/eprint/25517/ Numerical solution for the thermally insulated cracks in bonded dissimilar materials using hypersingular integral equations Hamzah, Khairum Nik Long, Nik Mohd Asri Senu, Norazak Eshkuvatov, Zainiddin K. The new system of hypersingular integral equations (HSIEs) for the thermally insulated inclined cracks and thermally insulated circular arc cracks subjected to remote shear stress in bonded dissimilar materials was formulated by using the modified complex potentials (MCPs) function method with the continuity conditions of the resultant force, displacement and heat conduction functions. This new system of HSIEs is derived from the elasticity problem and heat conduction problem by using crack opening displacement (COD) function and temperature jump along the crack faces. The appropriate quadrature formulas were used to solve numerically the new system of HSIEs for the unknown COD function and the known traction along the crack as the right hand term. Numerical solutions for them value of nondimensional stress intensity factors (SIFs) at all the cracks tips are illustrated. The comparison of nondimensional SIFs for the cracks with and without thermal is also illustrated Elsevier Inc. 2021-03 Article PeerReviewed text en http://eprints.utem.edu.my/id/eprint/25517/2/PUBLISH%20VERSION.PDF Hamzah, Khairum and Nik Long, Nik Mohd Asri and Senu, Norazak and Eshkuvatov, Zainiddin K. (2021) Numerical solution for the thermally insulated cracks in bonded dissimilar materials using hypersingular integral equations. Applied Mathematical Modelling, 91. pp. 358-373. ISSN 0307-904X (Unpublished) https://www.sciencedirect.com/science/article/pii/S0307904X20305758 https://doi.org/10.1016/j.apm.2020.09.054 |
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The new system of hypersingular integral equations (HSIEs) for the thermally insulated inclined cracks and thermally insulated circular arc cracks subjected to remote shear stress in bonded dissimilar materials was formulated by using the modified complex potentials
(MCPs) function method with the continuity conditions of the resultant force, displacement and heat conduction functions. This new system of HSIEs is derived from the elasticity problem and heat conduction problem by using crack opening displacement (COD)
function and temperature jump along the crack faces. The appropriate quadrature formulas were used to solve numerically the new system of HSIEs for the unknown COD function and the known traction along the crack as the right hand term. Numerical solutions for them value of nondimensional stress intensity factors (SIFs) at all the cracks tips are illustrated. The comparison of nondimensional SIFs for the cracks with and without thermal is also illustrated |
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Hamzah, Khairum Nik Long, Nik Mohd Asri Senu, Norazak Eshkuvatov, Zainiddin K. |
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Hamzah, Khairum Nik Long, Nik Mohd Asri Senu, Norazak Eshkuvatov, Zainiddin K. Numerical solution for the thermally insulated cracks in bonded dissimilar materials using hypersingular integral equations |
author_facet |
Hamzah, Khairum Nik Long, Nik Mohd Asri Senu, Norazak Eshkuvatov, Zainiddin K. |
author_sort |
Hamzah, Khairum |
title |
Numerical solution for the thermally insulated cracks in bonded dissimilar materials using hypersingular integral equations |
title_short |
Numerical solution for the thermally insulated cracks in bonded dissimilar materials using hypersingular integral equations |
title_full |
Numerical solution for the thermally insulated cracks in bonded dissimilar materials using hypersingular integral equations |
title_fullStr |
Numerical solution for the thermally insulated cracks in bonded dissimilar materials using hypersingular integral equations |
title_full_unstemmed |
Numerical solution for the thermally insulated cracks in bonded dissimilar materials using hypersingular integral equations |
title_sort |
numerical solution for the thermally insulated cracks in bonded dissimilar materials using hypersingular integral equations |
publisher |
Elsevier Inc. |
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2021 |
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http://eprints.utem.edu.my/id/eprint/25517/2/PUBLISH%20VERSION.PDF http://eprints.utem.edu.my/id/eprint/25517/ https://www.sciencedirect.com/science/article/pii/S0307904X20305758 https://doi.org/10.1016/j.apm.2020.09.054 |
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