Interface Thermal Resistance And Thermal Conductivity Of Polymer Composites At Different Types, Shapes, And Sizes Of Fillers: A Review

The growing demand toward miniaturization and power device packaging required new die-attach materials with high thermal conductivity (TC). Multitudinous attention is being paid to enhance the TC of thermally conductive polymer composites as it is easy to fabricate and environmentally friendly and h...

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Bibliographic Details
Main Authors: Omar, Ghazali, Masripan, Nor Azmmi, A. Hamid, Husna, Che Othaman, Siti Syahirah, Jasmee, Solehah
Format: Article
Language:English
Published: Wiley Online Library 2021
Online Access:http://eprints.utem.edu.my/id/eprint/25372/2/REVIEW%20PAPER%20SOLEHAH-COMPRESSED.PDF
http://eprints.utem.edu.my/id/eprint/25372/
https://onlinelibrary.wiley.com/doi/10.1002/pc.26029
https://doi.org/10.1002/pc.26029
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