The Influence Of Liquid Film Thickness On The Heat Transfer At Solid-Liquid Interfaces
Solid liquid (S-L) interface had been widely used in various industries. Many previous researcher had study the effect of thermal energy transfer across solid-liquid interface. However the effect of difference thickness of thin liquid film and thermal energy transfer had not been study in detail yet...
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| Format: | Thesis |
| Language: | English English |
| Published: |
2020
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| Online Access: | http://eprints.utem.edu.my/id/eprint/25172/1/The%20Influence%20Of%20Liquid%20Film%20Thickness%20On%20The%20Heat%20Transfer%20At%20Solid-Liquid%20Interfaces.pdf http://eprints.utem.edu.my/id/eprint/25172/2/The%20Influence%20Of%20Liquid%20Film%20Thickness%20On%20The%20Heat%20Transfer%20At%20Solid-Liquid%20Interfaces.pdf http://eprints.utem.edu.my/id/eprint/25172/ https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=118368 |
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| Summary: | Solid liquid (S-L) interface had been widely used in various industries. Many previous researcher had study the effect of thermal energy transfer across solid-liquid interface. However the effect of difference thickness of thin liquid film and thermal energy transfer had not been study in detail yet. Hence the objective of this report is to investigate the influence of difference liquid film thickness on the thermal energy transfer at solid-liquid interface by using molecular dynamic (MD) simulation. In this report the solid gold (Au) had been choose as two parallel solid walls where liquid methane (〖"CH" 〗_"4" ) will be place between them. The simulation test is focusing on the effect of (110) crystal plane only to the thermal energy transfer across the simulation system. The model consists of solid wall and liquid film will be described after the study had been made. The heat flux will be applied constantly from the centre to the both left and right side of the system. The structural quantities such as density distribution, temperature distribution and heat flux will be calculated during this test. The thermal boundary resistance (TBR) will be used to describe the characteristic of thermal energy transfer at S-L interface of the simulation system. The result show that the value of TBR decrease when the thickness of think film increase. Besides, the number of molecule will also affect the TBR value. When the number of molecule decrease the value of TBR will be decrease which will lead to increasing the amount of thermal energy transfer |
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