Development on copper to copper bonding optimization on low-k structure integrated circuit device
Wire bonding technology has been widely used in the semiconductor industry for interconnection between chip and lead frame or substrate.Gold (Au) is the most widely used metal for Integrated Circuit (IC) wire bonding because of its resistance to surface corrosion and high productivity through the Au...
Saved in:
Main Author: | |
---|---|
Format: | Thesis |
Language: | English English |
Published: |
2016
|
Subjects: | |
Online Access: | http://eprints.utem.edu.my/id/eprint/20494/1/Development%20on%20copper%20to%20copper%20bonding%20optimization%20on%20low-k%20structure%20integrated%20circuit%20device.pdf http://eprints.utem.edu.my/id/eprint/20494/2/Development%20on%20copper%20to%20copper%20bonding%20optimization%20on%20low-k%20structure%20integrated%20circuit%20device.pdf http://eprints.utem.edu.my/id/eprint/20494/ https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=104974 |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Internet
http://eprints.utem.edu.my/id/eprint/20494/1/Development%20on%20copper%20to%20copper%20bonding%20optimization%20on%20low-k%20structure%20integrated%20circuit%20device.pdfhttp://eprints.utem.edu.my/id/eprint/20494/2/Development%20on%20copper%20to%20copper%20bonding%20optimization%20on%20low-k%20structure%20integrated%20circuit%20device.pdf
http://eprints.utem.edu.my/id/eprint/20494/
https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=104974