Development on copper to copper bonding optimization on low-k structure integrated circuit device

Wire bonding technology has been widely used in the semiconductor industry for interconnection between chip and lead frame or substrate.Gold (Au) is the most widely used metal for Integrated Circuit (IC) wire bonding because of its resistance to surface corrosion and high productivity through the Au...

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Bibliographic Details
Main Author: Chan, Swee Guan
Format: Thesis
Language:English
English
Published: 2016
Subjects:
Online Access:http://eprints.utem.edu.my/id/eprint/20494/1/Development%20on%20copper%20to%20copper%20bonding%20optimization%20on%20low-k%20structure%20integrated%20circuit%20device.pdf
http://eprints.utem.edu.my/id/eprint/20494/2/Development%20on%20copper%20to%20copper%20bonding%20optimization%20on%20low-k%20structure%20integrated%20circuit%20device.pdf
http://eprints.utem.edu.my/id/eprint/20494/
https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=104974
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