Silver Spot Plating Technique.
Electroplating play an important roles in semiconductor manufacturing industries. A layer of silver or gold was selectively plated on the surface of lead frame by using electroplating technology. The purpose of depositing a layer of gold or silver on the surface of lead frame is to improve the bond...
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2005
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| Online Access: | http://eprints.usm.my/9773/1/Silver_Spot_Plating_Technique_%28PPKKimia%29_2005.pdf http://eprints.usm.my/9773/ |
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my.usm.eprints.9773 http://eprints.usm.my/9773/ Silver Spot Plating Technique. Siah, C.H. Aziz, N. Samad, Z Idris, M. N. Miskam, M.A. TP1-1185 Chemical technology Electroplating play an important roles in semiconductor manufacturing industries. A layer of silver or gold was selectively plated on the surface of lead frame by using electroplating technology. The purpose of depositing a layer of gold or silver on the surface of lead frame is to improve the bondability during die attach and wire bonding process. 2005-01 Conference or Workshop Item PeerReviewed application/pdf en http://eprints.usm.my/9773/1/Silver_Spot_Plating_Technique_%28PPKKimia%29_2005.pdf Siah, C.H. and Aziz, N. and Samad, Z and Idris, M. N. and Miskam, M.A. (2005) Silver Spot Plating Technique. In: Proceedings of the 4" Mechanical Engineering Research Colloquium (MERC 200511), 27-29 January 2005, School of Mechanical Engineering, USM, Penang, Malaysia. |
| institution |
Universiti Sains Malaysia |
| building |
Hamzah Sendut Library |
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Institutional Repository |
| continent |
Asia |
| country |
Malaysia |
| content_provider |
Universiti Sains Malaysia |
| content_source |
USM Institutional Repository |
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http://eprints.usm.my/ |
| language |
English |
| topic |
TP1-1185 Chemical technology |
| spellingShingle |
TP1-1185 Chemical technology Siah, C.H. Aziz, N. Samad, Z Idris, M. N. Miskam, M.A. Silver Spot Plating Technique. |
| description |
Electroplating play an important roles in semiconductor manufacturing industries. A layer of silver or gold was selectively plated on the surface of lead frame by using
electroplating technology. The purpose of depositing a layer of gold or silver on the surface of lead frame is to improve the bondability during die attach and wire bonding process.
|
| format |
Conference or Workshop Item |
| author |
Siah, C.H. Aziz, N. Samad, Z Idris, M. N. Miskam, M.A. |
| author_facet |
Siah, C.H. Aziz, N. Samad, Z Idris, M. N. Miskam, M.A. |
| author_sort |
Siah, C.H. |
| title |
Silver Spot Plating Technique. |
| title_short |
Silver Spot Plating Technique. |
| title_full |
Silver Spot Plating Technique. |
| title_fullStr |
Silver Spot Plating Technique. |
| title_full_unstemmed |
Silver Spot Plating Technique. |
| title_sort |
silver spot plating technique. |
| publishDate |
2005 |
| url |
http://eprints.usm.my/9773/1/Silver_Spot_Plating_Technique_%28PPKKimia%29_2005.pdf http://eprints.usm.my/9773/ |
| _version_ |
1643701366347005952 |
| score |
13.160551 |