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Effect Of Lead-free Solder And Gold Content On The Shear Strength, Toughness, IMC And Void Formation [TT267. C518 2004 f rb Kejuruteraan] [Microfiche 7715].

Study of interaction between lead free solder with gold and the mechanical toughness,shear strength of solder that associated with intermetallic compound IMC and void formation was carried out. Kajian tentang interaksi antara logam pateri tanpa plumbum dengan emas dan keliatan,kekuatan ricih yan...

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Main Author: Oo, Cheng Ee
Format: Thesis
Language:English
Published: 2004
Subjects:
TN1-997 Mining engineering. Metallurgy
Online Access:http://eprints.usm.my/6264/1/EFFECT_OF_LEAD-FREE_SOLDER_AND_GOLD_CONTENT_ON_THE_SHEAR.pdf
http://eprints.usm.my/6264/
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spelling my.usm.eprints.6264 http://eprints.usm.my/6264/ Effect Of Lead-free Solder And Gold Content On The Shear Strength, Toughness, IMC And Void Formation [TT267. C518 2004 f rb Kejuruteraan] [Microfiche 7715]. Oo, Cheng Ee TN1-997 Mining engineering. Metallurgy Study of interaction between lead free solder with gold and the mechanical toughness,shear strength of solder that associated with intermetallic compound IMC and void formation was carried out. Kajian tentang interaksi antara logam pateri tanpa plumbum dengan emas dan keliatan,kekuatan ricih yang berkait rapat dengan pembentukan kompaun antaralogam dan lompong. 2004-05 Thesis NonPeerReviewed application/pdf en http://eprints.usm.my/6264/1/EFFECT_OF_LEAD-FREE_SOLDER_AND_GOLD_CONTENT_ON_THE_SHEAR.pdf Oo, Cheng Ee (2004) Effect Of Lead-free Solder And Gold Content On The Shear Strength, Toughness, IMC And Void Formation [TT267. C518 2004 f rb Kejuruteraan] [Microfiche 7715]. Masters thesis, Universiti Sains Malaysia.
institution Universiti Sains Malaysia
building Hamzah Sendut Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Sains Malaysia
content_source USM Institutional Repository
url_provider http://eprints.usm.my/
language English
topic TN1-997 Mining engineering. Metallurgy
spellingShingle TN1-997 Mining engineering. Metallurgy
Oo, Cheng Ee
Effect Of Lead-free Solder And Gold Content On The Shear Strength, Toughness, IMC And Void Formation [TT267. C518 2004 f rb Kejuruteraan] [Microfiche 7715].
description Study of interaction between lead free solder with gold and the mechanical toughness,shear strength of solder that associated with intermetallic compound IMC and void formation was carried out. Kajian tentang interaksi antara logam pateri tanpa plumbum dengan emas dan keliatan,kekuatan ricih yang berkait rapat dengan pembentukan kompaun antaralogam dan lompong.
format Thesis
author Oo, Cheng Ee
author_facet Oo, Cheng Ee
author_sort Oo, Cheng Ee
title Effect Of Lead-free Solder And Gold Content On The Shear Strength, Toughness, IMC And Void Formation [TT267. C518 2004 f rb Kejuruteraan] [Microfiche 7715].
title_short Effect Of Lead-free Solder And Gold Content On The Shear Strength, Toughness, IMC And Void Formation [TT267. C518 2004 f rb Kejuruteraan] [Microfiche 7715].
title_full Effect Of Lead-free Solder And Gold Content On The Shear Strength, Toughness, IMC And Void Formation [TT267. C518 2004 f rb Kejuruteraan] [Microfiche 7715].
title_fullStr Effect Of Lead-free Solder And Gold Content On The Shear Strength, Toughness, IMC And Void Formation [TT267. C518 2004 f rb Kejuruteraan] [Microfiche 7715].
title_full_unstemmed Effect Of Lead-free Solder And Gold Content On The Shear Strength, Toughness, IMC And Void Formation [TT267. C518 2004 f rb Kejuruteraan] [Microfiche 7715].
title_sort effect of lead-free solder and gold content on the shear strength, toughness, imc and void formation [tt267. c518 2004 f rb kejuruteraan] [microfiche 7715].
publishDate 2004
url http://eprints.usm.my/6264/1/EFFECT_OF_LEAD-FREE_SOLDER_AND_GOLD_CONTENT_ON_THE_SHEAR.pdf
http://eprints.usm.my/6264/
_version_ 1643700398853193728
score 13.160551

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