Simulation Of Flexible Capacitive Strain Sensor For Food Packaging Applications

• Main Author: Salleh, Muhammad Safwan
• Format: Monograph
• Language: English
• Published: Universiti Sains Malaysia 2022
• Subjects: T Technology; TJ Mechanical engineering and machinery
• Online Access: http://eprints.usm.my/55593/1/Simulation%20Of%20Flexible%20Capacitive%20Strain%20Sensor%20For%20Food%20Packaging%20Applications_Muhammad%20Safwan%20Salleh.pdf; http://eprints.usm.my/55593/

Due to the variety of uses for strain sensors, there is a growing demand for flexible, affordable, and low-power devices for strain. This paper presents the simulation of the flexible Interdigitated Capacitive (IDC) strain sensor for food packaging applications. In the food packaging application, th...