Structural Integrity Investigation Of SAC305 Lead Free Solder

• Main Author: Ganiashan, Eesvaran
• Format: Monograph
• Language: English
• Published: Universiti Sains Malaysia 2022
• Subjects: T Technology; TJ Mechanical engineering and machinery
• Online Access: http://eprints.usm.my/55559/1/Structural%20Integrity%20Investigation%20Of%20SAC305%20Lead%20Free%20Solder_Eesvaran%20Ganiashan.pdf; http://eprints.usm.my/55559/

Improvement in solder strength is instantly becoming one of the most important concerns in the electronics industry, particularly in Printed Circuit Board (PCB) applications. Because of the design and mounting of electronic components on a substrate or PCB, solder in electronic connections may crack...