Time Domain Reflection Method To Detect Copper Wire Micro Crack Weld Defect
Structural integrity of wire bonding interconnection is having a significant impact on the quality of microelectronic devices. Conventional electrical test methodology is unable to detect 1 to 20 m of cracks that exists in wire bond stitch weld. This micro crack has becomes prominent in Power MO...
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| Format: | Thesis |
| Language: | English |
| Published: |
2016
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| Online Access: | http://eprints.usm.my/45796/1/Time%20Domain%20Reflection%20Method%20To%20Detect%20Copper%20Wire%20Micro%20Crack%20Weld%20Defect.pdf http://eprints.usm.my/45796/ |
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