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Creep And Isothermal Fatigue Behaviour Of Eutectic SnPb, SnBi And SnZn Solders For Microelectronic Packaging At Mildly Elevated Temperatures

Interconnect materials are used to connect surface mounting components and other passive and discrete circuit components on to copper pads or lands, and in holes on the printed circuit boards. Presently, the industrial practice is using thermal cycling as a method for reliability testing of circuit...

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Main Author: Hashim, Md. Amin
Format: Thesis
Language:English
Published: 2011
Subjects:
TN1-997 Mining engineering. Metallurgy
Online Access:http://eprints.usm.my/42008/1/MD_AMIN_HASHIM.pdf
http://eprints.usm.my/42008/
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spelling my.usm.eprints.42008 http://eprints.usm.my/42008/ Creep And Isothermal Fatigue Behaviour Of Eutectic SnPb, SnBi And SnZn Solders For Microelectronic Packaging At Mildly Elevated Temperatures Hashim, Md. Amin TN1-997 Mining engineering. Metallurgy Interconnect materials are used to connect surface mounting components and other passive and discrete circuit components on to copper pads or lands, and in holes on the printed circuit boards. Presently, the industrial practice is using thermal cycling as a method for reliability testing of circuit boards with assembled components. Bulk specimens of 63Sn37Pn solder alloy were subjected to isothermal fatigue at three mildly elevated temperatures (30, 40 and 50oC), loading frequencies (6, 60 and 600 CPM) and at different applied peak stresses (ranging from 8.75 to 33.25 MPa). 2011-01 Thesis NonPeerReviewed application/pdf en http://eprints.usm.my/42008/1/MD_AMIN_HASHIM.pdf Hashim, Md. Amin (2011) Creep And Isothermal Fatigue Behaviour Of Eutectic SnPb, SnBi And SnZn Solders For Microelectronic Packaging At Mildly Elevated Temperatures. PhD thesis, Universiti Sains Malaysia.
institution Universiti Sains Malaysia
building Hamzah Sendut Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Sains Malaysia
content_source USM Institutional Repository
url_provider http://eprints.usm.my/
language English
topic TN1-997 Mining engineering. Metallurgy
spellingShingle TN1-997 Mining engineering. Metallurgy
Hashim, Md. Amin
Creep And Isothermal Fatigue Behaviour Of Eutectic SnPb, SnBi And SnZn Solders For Microelectronic Packaging At Mildly Elevated Temperatures
description Interconnect materials are used to connect surface mounting components and other passive and discrete circuit components on to copper pads or lands, and in holes on the printed circuit boards. Presently, the industrial practice is using thermal cycling as a method for reliability testing of circuit boards with assembled components. Bulk specimens of 63Sn37Pn solder alloy were subjected to isothermal fatigue at three mildly elevated temperatures (30, 40 and 50oC), loading frequencies (6, 60 and 600 CPM) and at different applied peak stresses (ranging from 8.75 to 33.25 MPa).
format Thesis
author Hashim, Md. Amin
author_facet Hashim, Md. Amin
author_sort Hashim, Md. Amin
title Creep And Isothermal Fatigue Behaviour Of Eutectic SnPb, SnBi And SnZn Solders For Microelectronic Packaging At Mildly Elevated Temperatures
title_short Creep And Isothermal Fatigue Behaviour Of Eutectic SnPb, SnBi And SnZn Solders For Microelectronic Packaging At Mildly Elevated Temperatures
title_full Creep And Isothermal Fatigue Behaviour Of Eutectic SnPb, SnBi And SnZn Solders For Microelectronic Packaging At Mildly Elevated Temperatures
title_fullStr Creep And Isothermal Fatigue Behaviour Of Eutectic SnPb, SnBi And SnZn Solders For Microelectronic Packaging At Mildly Elevated Temperatures
title_full_unstemmed Creep And Isothermal Fatigue Behaviour Of Eutectic SnPb, SnBi And SnZn Solders For Microelectronic Packaging At Mildly Elevated Temperatures
title_sort creep and isothermal fatigue behaviour of eutectic snpb, snbi and snzn solders for microelectronic packaging at mildly elevated temperatures
publishDate 2011
url http://eprints.usm.my/42008/1/MD_AMIN_HASHIM.pdf
http://eprints.usm.my/42008/
_version_ 1643710384855580672
score 13.160551

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