Characterization Of Ti/TiN/AlCu Film Stack Prepared By Physical Vapor Deposition
Physical vapor deposition (PVD) method is widely used in semiconductor industry in metallic film deposition process. It has been found that the metallic film properties are influenced by the parameter change in the PVD sputtering machine. Ionized physical vapor deposition (I-PVD) came about when ele...
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| Main Author: | |
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| Format: | Thesis |
| Language: | English |
| Published: |
2012
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| Online Access: | http://eprints.usm.my/41945/1/LEOW_MUN_TYNG.pdf http://eprints.usm.my/41945/ |
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