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Investigation Of Process Time-Delay On Polyimide With Different Thicknesses For Photolithography Process

Polyimides (PI), particularly photosensitive polyimide (PSPI) has wide applications in semiconductor industries due to their good thermal, mechanical and chemical properties. During photolithography process, there might be time delays from coat to expose and from expose to develop. The time delay co...

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Main Author: Ang , Karen Huei Ling
Format: Thesis
Language:English
Published: 2011
Subjects:
TN1-997 Mining engineering. Metallurgy
Online Access:http://eprints.usm.my/41879/1/KAREN_ANG_HUEI_LING.pdf
http://eprints.usm.my/41879/
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spelling my.usm.eprints.41879 http://eprints.usm.my/41879/ Investigation Of Process Time-Delay On Polyimide With Different Thicknesses For Photolithography Process Ang , Karen Huei Ling TN1-997 Mining engineering. Metallurgy Polyimides (PI), particularly photosensitive polyimide (PSPI) has wide applications in semiconductor industries due to their good thermal, mechanical and chemical properties. During photolithography process, there might be time delays from coat to expose and from expose to develop. The time delay could change the profile of the structures and residues of precursor might leave on the film. In Infineon technologies, those wafers are scrapped if time delay exceeded 5 hours and every scrapped cost RM37500. As such, a study is carried out to investigate the effect of time delay in photolithography process to the cured polyimide film. 2011-06 Thesis NonPeerReviewed application/pdf en http://eprints.usm.my/41879/1/KAREN_ANG_HUEI_LING.pdf Ang , Karen Huei Ling (2011) Investigation Of Process Time-Delay On Polyimide With Different Thicknesses For Photolithography Process. Masters thesis, Universiti Sains Malaysia.
institution Universiti Sains Malaysia
building Hamzah Sendut Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Sains Malaysia
content_source USM Institutional Repository
url_provider http://eprints.usm.my/
language English
topic TN1-997 Mining engineering. Metallurgy
spellingShingle TN1-997 Mining engineering. Metallurgy
Ang , Karen Huei Ling
Investigation Of Process Time-Delay On Polyimide With Different Thicknesses For Photolithography Process
description Polyimides (PI), particularly photosensitive polyimide (PSPI) has wide applications in semiconductor industries due to their good thermal, mechanical and chemical properties. During photolithography process, there might be time delays from coat to expose and from expose to develop. The time delay could change the profile of the structures and residues of precursor might leave on the film. In Infineon technologies, those wafers are scrapped if time delay exceeded 5 hours and every scrapped cost RM37500. As such, a study is carried out to investigate the effect of time delay in photolithography process to the cured polyimide film.
format Thesis
author Ang , Karen Huei Ling
author_facet Ang , Karen Huei Ling
author_sort Ang , Karen Huei Ling
title Investigation Of Process Time-Delay On Polyimide With Different Thicknesses For Photolithography Process
title_short Investigation Of Process Time-Delay On Polyimide With Different Thicknesses For Photolithography Process
title_full Investigation Of Process Time-Delay On Polyimide With Different Thicknesses For Photolithography Process
title_fullStr Investigation Of Process Time-Delay On Polyimide With Different Thicknesses For Photolithography Process
title_full_unstemmed Investigation Of Process Time-Delay On Polyimide With Different Thicknesses For Photolithography Process
title_sort investigation of process time-delay on polyimide with different thicknesses for photolithography process
publishDate 2011
url http://eprints.usm.my/41879/1/KAREN_ANG_HUEI_LING.pdf
http://eprints.usm.my/41879/
_version_ 1643710347457069056
score 13.211869

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