Heat Pipes In Electronic Packaging

Industri electronik berkembang ke arah qualiti dan kelajuan computational yang tinggi. The electronic industry is developing towards higher quality and computational speed. It has led to the increase in chip heat fluxes.

Saved in:
Bibliographic Details
Main Author: Munusamy, Sri Jaiandran
Format: Thesis
Language:English
Published: 2006
Subjects:
Online Access:http://eprints.usm.my/29322/1/Heat_pipes_in_electronic_packaging.pdf
http://eprints.usm.my/29322/
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:Industri electronik berkembang ke arah qualiti dan kelajuan computational yang tinggi. The electronic industry is developing towards higher quality and computational speed. It has led to the increase in chip heat fluxes.