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Design Of Crack Detection System Software For IC Package Using Blob Analysis And Neural Network.

In this research, three methods for the detection of crack defects on integrated circuit (IC) packages are proposed. These methods use blob analysis technique in image processing stage, and use multi-layered perceptron (MLP) neural network to classify the IC package.

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Bibliographic Details
Main Authors: Samad, Rosdiyana, Arshad, Mohd Rizal, Samad, Zahurin
Format: Conference or Workshop Item
Language:English
Published: 2005
Subjects:
TK1-9971 Electrical engineering. Electronics. Nuclear engineering
Online Access:http://eprints.usm.my/14359/1/design.pdf
http://eprints.usm.my/14359/
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id my.usm.eprints.14359
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spelling my.usm.eprints.14359 http://eprints.usm.my/14359/ Design Of Crack Detection System Software For IC Package Using Blob Analysis And Neural Network. Samad, Rosdiyana Arshad, Mohd Rizal Samad, Zahurin TK1-9971 Electrical engineering. Electronics. Nuclear engineering In this research, three methods for the detection of crack defects on integrated circuit (IC) packages are proposed. These methods use blob analysis technique in image processing stage, and use multi-layered perceptron (MLP) neural network to classify the IC package. 2005 Conference or Workshop Item PeerReviewed application/pdf en http://eprints.usm.my/14359/1/design.pdf Samad, Rosdiyana and Arshad, Mohd Rizal and Samad, Zahurin (2005) Design Of Crack Detection System Software For IC Package Using Blob Analysis And Neural Network. In: Proceedings of the 9th WSEAS International CSCC Multiconference : Circuits ’05, System ’05, Computer ’05, Communication ‘05, , 11-16 July 2005 , Vouliagmeni, Athens, Greece.
institution Universiti Sains Malaysia
building Hamzah Sendut Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Sains Malaysia
content_source USM Institutional Repository
url_provider http://eprints.usm.my/
language English
topic TK1-9971 Electrical engineering. Electronics. Nuclear engineering
spellingShingle TK1-9971 Electrical engineering. Electronics. Nuclear engineering
Samad, Rosdiyana
Arshad, Mohd Rizal
Samad, Zahurin
Design Of Crack Detection System Software For IC Package Using Blob Analysis And Neural Network.
description In this research, three methods for the detection of crack defects on integrated circuit (IC) packages are proposed. These methods use blob analysis technique in image processing stage, and use multi-layered perceptron (MLP) neural network to classify the IC package.
format Conference or Workshop Item
author Samad, Rosdiyana
Arshad, Mohd Rizal
Samad, Zahurin
author_facet Samad, Rosdiyana
Arshad, Mohd Rizal
Samad, Zahurin
author_sort Samad, Rosdiyana
title Design Of Crack Detection System Software For IC Package Using Blob Analysis And Neural Network.
title_short Design Of Crack Detection System Software For IC Package Using Blob Analysis And Neural Network.
title_full Design Of Crack Detection System Software For IC Package Using Blob Analysis And Neural Network.
title_fullStr Design Of Crack Detection System Software For IC Package Using Blob Analysis And Neural Network.
title_full_unstemmed Design Of Crack Detection System Software For IC Package Using Blob Analysis And Neural Network.
title_sort design of crack detection system software for ic package using blob analysis and neural network.
publishDate 2005
url http://eprints.usm.my/14359/1/design.pdf
http://eprints.usm.my/14359/
_version_ 1643702641928175616
score 13.15806

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