Electroless plating as surface finishing in electronic packaging

• Main Author: Mohamed Ariff, Azmah Hanim
• Format: Book Section
• Language: English
• Published: Elsevier 2017
• Online Access: http://psasir.upm.edu.my/id/eprint/63090/1/Electroless%20plating%20as%20surface%20finishing%20in%20electronic%20packaging.pdf; http://psasir.upm.edu.my/id/eprint/63090/; http://www.prims.upm.edu.my/uploads/2016/410902_isbn number book plating.pdf , http://www.prims.upm.edu.my/uploads/2016/410903_chapter buku-electroless plating.pdf

Electroless plating is one type of surface finish deposition method in electronic packaging. With advancements in electronic products, the industry is shifting toward this process based on its advantages. However, the electroless plating process itself is unstable. Its stability fully depends on the substrate material, the pretreatment process, the type of solution used, and the pH and temperature during plating. In this article, focus is given to the three different types of electroless plating formulations used in electronic packaging that have been studied by previous researchers: electroless nickel, electroless palladium, and electroless gold.