Structural and electrical properties of nickel–iron thin film on copper substrate for dynamic random access memory applications

• Main Authors: Saeed, Ayad, Ruthramurthy, Balachandran, Wong, Hin Yong, Ong, Boon Hoong, Tan, Kar Ban, Yow, Ho Kwang, Sreekantan, Srimala
• Format: Article
• Language: English
• Published: M A I K Nauka - Interperiodica 2016
• Online Access: http://psasir.upm.edu.my/id/eprint/53903/1/Structural%20and%20electrical%20properties%20of%20nickel%E2%80%93iron%20thin%20film%20on%20copper%20substrate%20for%20dynamic%20random%20access%20memory%20applications.pdf; http://psasir.upm.edu.my/id/eprint/53903/; https://link.springer.com/article/10.1134/S1023193516040121

Using pulse electrodeposition technique, nano crystalline NiFe films were deposited on conductive copper substrates, under galvanostatic mode in an ultrasonic field at different conditions such as pulse current magnitude, deposition time and ultrasonic bath temperature. As-prepared NiFe/Cu thin film...