A study on the effects of environment on curing characteristics of thixotropic and room temperature cured epoxy-based adhesives using DMTA

• Main Authors: Ahmad, Zakiah, Hassan, Rohana, Md. Tahir, Paridah
• Format: Article
• Language: English
• Published: Academy of Sciences Malaysia 2013
• Online Access: http://psasir.upm.edu.my/id/eprint/29183/1/A%20study%20on%20the%20effects%20of%20environment%20on%20curing%20characteristics%20of%20thixotropic%20and%20room%20temperature%20cured%20epoxy-based%20adhesives%20using%20DMTA.pdf; http://psasir.upm.edu.my/id/eprint/29183/; http://www.akademisains.gov.my/asmsj/index.php/published-articles

This study investigated the thermal properties of three room temperature curing adhesives containing nano-particles which were thixotropic and shear thinning which allowed injection into overhead holes when exposed to different environmental conditions. Viscosity and shear stress of the adhesives were measured as a function of shear rate. The thermal behaviour of the adhesives were measured using dynamic mechanical thermal analysis following exposure to different temperatures and humidities which included temperatures of 20°C. 30°C and 50°C, relative humidities of 65% RH, 75% RH and 95% RH, soaked in water at 20°C and placed in the oven at 50°C. The dynamic thermal properties reported include storage and loss modulus, the loss tangent and the glass transition temperature (Tg). For nano- and micro-particles filled adhesives, the Tg increased with the temperature increase, even though the adhesives were subjected to high humidity and this was due to further cross-linking. The results showed that room temperature cured epoxies were only partially cured at room temperature.