Incorporation of surface mount technology manufacturing (chip mountung) to LED Chip on Board
Future manufacturing technology will drive global growth through innovation in production. Companies are riding on a scale economy to achieve lower costs and keep prices down; thus, keeping ahead of the competition is necessary to remain competitive. In LED Chip on Board (COB) industry, there has...
Saved in:
| Main Author: | |
|---|---|
| Format: | Thesis |
| Language: | English |
| Published: |
2019
|
| Subjects: | |
| Online Access: | http://psasir.upm.edu.my/id/eprint/114739/1/114739.pdf http://psasir.upm.edu.my/id/eprint/114739/ http://ethesis.upm.edu.my/id/eprint/18180 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| Summary: | Future manufacturing technology will drive global growth through innovation in
production. Companies are riding on a scale economy to achieve lower costs and
keep prices down; thus, keeping ahead of the competition is necessary to remain
competitive. In LED Chip on Board (COB) industry, there has been a substantial
increase in market demand in recent years, leading to a need for a more costeffective
manufacturing process. In Opto-Semiconductor, LED COB products are
still produced using batch processing. When product development demand peaks,
growth and production are frequently caught unprepared, leading to short-term
business losses and long-term deterioration of consumer confidence waiting one
year for product. Customers will then flock to the rivals for replacement goods,
causing harm to the bottom line of the company. The ultimate objective of this
research is to enhance the current LED COB manufacturing process by leveraging
surface mount technology (SMT) at the front of the line, saving money, improving
the process and improving overall product development cycle time. Based on the
research carried out, positive results anticipated from the use of SMT with
additional production output of six times more product performance compared to
the current output of LED COB, with a capability of printing 960 glue dot in one
print, able to maximize COB light-emitting surface (LES) size more than 50mm
size and COB board with more panes. These options will help the designer of
product development explore new LED COB in the future. This would ensure the
competitiveness of production in the future. The Six Sigma method (Define,
Measure, Analyze, Improve and Control-DMAIC) with the Design of Experiment
(DOE) approach will be used. |
|---|