Flux residue cleaning process optimization effect on Flip Chip Ball Grid Array reliability
This paper discusses the evaluation and characterizations of the cleaning the organic residues on Flip Chip Ceramic Ball Grid Array (FCCBGA) package. Flux used for Control Collapse Chip Connection (C4) die attachment during assemblies could remain on the die surface as organic residues, thus affecti...
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| Main Authors: | , , , , , |
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| Format: | |
| Published: |
2018
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| Online Access: | http://dspace.uniten.edu.my/jspui/handle/123456789/8797 |
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