Comparison study on reliability performance for polymer core solder balls under multiple reflow and HTS stress tests
Drop ball reliability for Ball Grid Array (BGA) package on lead-free product is a major reliability concern. Integrating a polymer core in the solder ball could be a good strategy to dissipate stress better compared to the purely metallic solder ball. However, the diffusion rate of the copper is muc...
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| Main Authors: | , , , |
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2018
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| Online Access: | http://dspace.uniten.edu.my/jspui/handle/123456789/7349 |
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