Comparison study on shear strength and intermetallic compound for SAC and polymer core solder balls
Solder joint strength on lead-free product is a reliability concern when subjected to the different environment stress in comparison to leaded product. Integrating a lead-free polymer core inside the solder ball may be a good strategy, where the polymer core could function as a stress buffer to diss...
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| Main Authors: | , , , |
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2018
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| Online Access: | http://dspace.uniten.edu.my/jspui/handle/123456789/7348 |
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