Cover Image

Electrical and joule heating relationship investigation using finite element method

The finite element method is vastly used in material strength analysis. The nature of the finite element solver, which solves the Fourier equation of stress and strain analysis, made it possible to apply for conduction heat transfer Fourier Equation. Similarly the Current and voltage equation is als...

Full description

Saved in:
Bibliographic Details
Main Authors: Thangaraju, S.K., Munisamy, K.M.
Format: Article
Language:en_US
Published: 2017
Tags: Add Tag
No Tags, Be the first to tag this record!
id my.uniten.dspace-6062
record_format dspace
spelling my.uniten.dspace-60622018-02-21T08:05:33Z Electrical and joule heating relationship investigation using finite element method Thangaraju, S.K. Munisamy, K.M. The finite element method is vastly used in material strength analysis. The nature of the finite element solver, which solves the Fourier equation of stress and strain analysis, made it possible to apply for conduction heat transfer Fourier Equation. Similarly the Current and voltage equation is also liner Fourier equation. The nature of the governing equation makes it possible to numerical investigate the electrical joule heating phenomena in electronic component. This paper highlights the Finite Element Method (FEM) application onto semiconductor interconnects to determine the specific contact resistance (SCR). Metal and semiconductor interconnects is used as model. The result confirms the possibility and validity of FEM utilization to investigate the Joule heating due electrical resistance. 2017-12-08T09:08:55Z 2017-12-08T09:08:55Z 2015 Article 10.1088/1757-899X/88/1/012036 en_US Electrical and joule heating relationship investigation using finite element method. IOP Conference Series: Materials Science and Engineering, 88(1), [012036
institution Universiti Tenaga Nasional
building UNITEN Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Tenaga Nasional
content_source UNITEN Institutional Repository
url_provider http://dspace.uniten.edu.my/
language en_US
description The finite element method is vastly used in material strength analysis. The nature of the finite element solver, which solves the Fourier equation of stress and strain analysis, made it possible to apply for conduction heat transfer Fourier Equation. Similarly the Current and voltage equation is also liner Fourier equation. The nature of the governing equation makes it possible to numerical investigate the electrical joule heating phenomena in electronic component. This paper highlights the Finite Element Method (FEM) application onto semiconductor interconnects to determine the specific contact resistance (SCR). Metal and semiconductor interconnects is used as model. The result confirms the possibility and validity of FEM utilization to investigate the Joule heating due electrical resistance.
format Article
author Thangaraju, S.K.
Munisamy, K.M.
spellingShingle Thangaraju, S.K.
Munisamy, K.M.
Electrical and joule heating relationship investigation using finite element method
author_facet Thangaraju, S.K.
Munisamy, K.M.
author_sort Thangaraju, S.K.
title Electrical and joule heating relationship investigation using finite element method
title_short Electrical and joule heating relationship investigation using finite element method
title_full Electrical and joule heating relationship investigation using finite element method
title_fullStr Electrical and joule heating relationship investigation using finite element method
title_full_unstemmed Electrical and joule heating relationship investigation using finite element method
title_sort electrical and joule heating relationship investigation using finite element method
publishDate 2017
_version_ 1644493832072462336
score 13.222552

Similar Items