Influence of junction formation process variables on diffusion sheet resistance using statistical design of experiment methodology

• Main Authors: Hashim, Uda, Shaari, Abu Hassan, Ahmad, Ibrahim, Shaari, Sahbudin, Majlis, Burhanudin Yeop
• Published: 2017
• Online Access: http://dspace.uniten.edu.my:8080/jspui/handle/123456789/5339

The statistical design of experiment technique was used to study the influence of junction formation process variables on the diffusion sheet resistance. Two-level screening experiment with 23 factorial design was used to evaluate three process variables in eight combination runs. The factors were implementation dose of BF2 and Ar, drive-in temperature and drive-in time. The analysis of variance used to analyze the data shows that all main variables are important for arsenic implanted wafer and only drive-in temperature factor is important for boron implanted wafer.