Performance of Carbon Nanotube on Nickel-Plated Copper Substrate Using Electrophoretic Deposition Process for Electronic Cooling Application: Response Surface Method Optimization

• Main Authors: Bahru R., Zamri M.F.M.A.
• Other Authors: 57195836029
• Format: Article
• Published: Springer Nature 2025

Thermal interface materials (TIMs) have emerged as a potential material for heat dissipation in the cooling system due to their good materials in heat transfer and help protect devices from damage. The main challenge of TIMs is the lower thermal conductivity of materials and poor surface contact, re...