Analysis of Transmission Performance for Fine Pitch Interconnect

• المؤلفون الرئيسيون: Leong H.Y., Yap B.K., Chin L.P., Zuraida E.E., Awang Mat Z.
• مؤلفون آخرون: 55787052600
• التنسيق: Book chapter
• منشور في: Trans Tech Publications Ltd 2024
• الموضوعات: electrical performance; fine pitch interconnect; insulated Cu wire; signal transmission

Wire bonding is the preferred interconnection in the IC packaging. Understanding the electrical performance of bonding wire as transmission line is utmost important. To date, there are very limited studies on the transmission performance of fine pitch bare bonding wire especially the insulated wires...