Preparation and Characterization of CuO-Au Hybrid Nanofluid with Different Mixing Ratio

Nanofluids have gained a lot of attention from researchers in recent decades due to the growing need in industrial applications as a promising heat transfer fluid. In the quest to further enhance the heat transfer capability of nanofluids, researchers have delved into the mixture of two or more type...

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Bibliographic Details
Main Authors: Iqhwan M.A., Wai O.J., Gunnasegaran P.
Other Authors: 58614662300
Format: Conference Paper
Published: Springer Science and Business Media Deutschland GmbH 2024
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Summary:Nanofluids have gained a lot of attention from researchers in recent decades due to the growing need in industrial applications as a promising heat transfer fluid. In the quest to further enhance the heat transfer capability of nanofluids, researchers have delved into the mixture of two or more type of nanoparticles with base fluids which is termed as hybrid nanofluids. This novel high-class working fluids are often tailored to meet specific applications as it manages to bring about the benefits of both type of nanoparticles. However, the agglomeration process still remains a challenge to date in the field of nanofluids. Hence, preparation stage of the hybrid nanofluids is significant to mitigate the impact of agglomeration rate. In this paper, the preparation process of CuO-Au hybrid nanofluids and the thermophysical properties of the prepared hybrid nanofluids is studied. The thermophysical properties of the prepared hybrid nanofluids is characterized through thermal conductivity, viscosity, and density. At 40��C, the highest thermal conductivity for gold (Au) mono nanofluid is 2.65 W/mK, while the highest thermal conductivity for CuO-Au hybrid nanofluid with the mixing ratio of (3:7) is 1.53 W/mK. The viscosity for hybrid nanofluids is higher compared to mono nanofluids. Set with mixing of a higher ratio of Au nanoparticles yields higher density. � 2023, The Author(s), under exclusive license to Springer Nature Singapore Pte Ltd.