Effect of treated silver nanoparticles to electrical conductivity improvement of electrically conductive adhesive (ECA)

• Main Authors: Kornain Z., Amin N., Jalar A., Cheah A.Y., Ahmad I.
• 其他作者: 24341024000
• 格式: Conference paper
• 出版: 2023
• 主题: Brazing; Chip scale packages; Composite micromechanics; Cost reduction; Coupling agents; Electric conductivity; Electric network analysis; Epoxy resins; Lead; Processing; Silanes; Silver; Surface treatment; Welding; After-treatment; Binder matrix; Conductive fillers; Current conductivity; Dispersivity; Electrical conductivity; Electrical property; Electrically conductive adhesives; Electronic Packaging; Environmental friendliness; Epoxy systems; Filler loading; Fine-pitch capability; Interconnect materials; Lead solders; Light microscopy; Metal fillers; Morphological study; Processing costs; Processing steps; Processing temperature; Silver nanoparticles; Silver particles; Fillers

Electrically conductive adhesive (ECA) is a popular alternative to replace lead solder interconnect material in most areas of electronic packaging. ECA mainly consists of an organic/polymeric binder matrix and metal filler. These composite materials provide both physical adhesion and electrical cond...