Finite element analysis of thermal distributions of solder ball in flip chip ball grid array using ABAQUS

• Main Authors: Kar Y.B., Talik N.A., Sauli Z., Fei J.S., Retnasamy V.
• Other Authors: 26649255900
• Format: Article
• Published: 2023
• Subjects: ABAQUS; Finite element analysis; Flip chip; Solder ball; Stress (materials); Thermal analysis; Electronics packaging; Finite element method; Flip chip devices; Soldering; Stress concentration; Thermal stress; Thermoanalysis; ABAQUS software; Design/methodology/approach; Direct measurement; Elasto-plastic analysis; Electronic Packaging; Experimental measurements; Finite element method FEM; Finite element models; Flip chip ball grid array; Flip-chip packages; High stress; Interconnection technology; Lead-Free; Plain strain; SAC-solders; Solder balls; Solder Bump; Solder interconnections; Stress(materials); Thermal distributions; Thermal induced stress; Thermal loadings; Thermal stress effects; Thermal conductivity

Purpose - The increased use recently of area-array technology in electronic packaging has similarly increased the importance of predicting the thermal distribution of area-array solder interconnection. As the interconnection technology for flip chip package is getting finer and smaller, it is extrem...