Spatial analysis of underfill flow in flip-chip encapsulation
Air; Filling; Flip chip devices; Flow patterns; Soldering; Design/methodology/approach; Flip-chip encapsulation; Package designers; Process enhancements; Research studies; Spatial analysis; Unit cell approach; Visualization tools; Spatial variables measurement
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Emerald Group Holdings Ltd.
2023
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my.uniten.dspace-262912023-05-29T17:08:47Z Spatial analysis of underfill flow in flip-chip encapsulation Ng F.C. Zawawi M.H. Abas M.A. 57192101900 39162217600 56893346700 Air; Filling; Flip chip devices; Flow patterns; Soldering; Design/methodology/approach; Flip-chip encapsulation; Package designers; Process enhancements; Research studies; Spatial analysis; Unit cell approach; Visualization tools; Spatial variables measurement Purpose: The purpose of the study is to investigate the spatial aspects of underfill flow during the flip-chip encapsulation process, for instance, meniscus evolution and contact line jump (CLJ). Furthermore, a spatial-based void formation mechanism during the underfill flow was formulated. Design/methodology/approach: The meniscus evolution of underfill fluid subtended between the bump array and the CLJ phenomenon were visualized numerically using the micro-mesh unit cell approach. Additionally, the meniscus evolution and CLJ phenomenon were modelled analytically based on the formulation of capillary physics. Meanwhile, the mechanism of void formation was explained numerically and analytically. Findings: Both the proposed analytical and current numerical findings achieved great consensus and were well-validated experimentally. The variation effects of bump pitch on the spatial aspects were analyzed and found that the meniscus arc radius and filling distance increase with the pitch, while the subtended angle of meniscus arc is invariant with the pitch size. For larger pitch, the jump occurs further away from the bump entrance and takes longer time to attain the equilibrium meniscus. This inferred that the concavity of meniscus arc was influenced by the bump pitch. On the voiding mechanism, air void was formed from the air entrapment because of the fluid-bump interaction. Smaller voids tend to merge into a bigger void through necking and, subsequently, propagate along the underfill flow. Practical implications: The microscopic spatial analysis of underfill flow would explain fundamentally how the bump design will affect the macroscopic filling time. This not only provides alternative visualization tool to analyze flow pattern in the industry but also enables the development of accurate analytical filling time model. Moreover, the void formation mechanism gave substantial insights to understand the root causes of void defects and allow possible solutions to be formulated to tackle this issue. Additionally, the microfluidics sector could also benefit from these spatial analysis insights. Originality/value: Spatial analysis on underfill flow is scarcely conducted, as the past research studies mainly emphasized on the temporal aspects. Additionally, this work presented a new mechanism on the void formation based on the fluid-bump interaction, in which the formation and propagation of micro-voids were numerically visualized for the first time. The findings from current work provided fundamental information on the flow interaction between underfill fluid and solder bump to the package designers for optimization work and process enhancement. � 2020, Emerald Publishing Limited. Final 2023-05-29T09:08:47Z 2023-05-29T09:08:47Z 2021 Article 10.1108/SSMT-05-2020-0017 2-s2.0-85090206287 https://www.scopus.com/inward/record.uri?eid=2-s2.0-85090206287&doi=10.1108%2fSSMT-05-2020-0017&partnerID=40&md5=93a8ff604e3f249c9661843c88197a97 https://irepository.uniten.edu.my/handle/123456789/26291 33 2 112 127 Emerald Group Holdings Ltd. Scopus |
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Air; Filling; Flip chip devices; Flow patterns; Soldering; Design/methodology/approach; Flip-chip encapsulation; Package designers; Process enhancements; Research studies; Spatial analysis; Unit cell approach; Visualization tools; Spatial variables measurement |
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57192101900 |
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57192101900 Ng F.C. Zawawi M.H. Abas M.A. |
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Article |
| author |
Ng F.C. Zawawi M.H. Abas M.A. |
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Ng F.C. Zawawi M.H. Abas M.A. Spatial analysis of underfill flow in flip-chip encapsulation |
| author_sort |
Ng F.C. |
| title |
Spatial analysis of underfill flow in flip-chip encapsulation |
| title_short |
Spatial analysis of underfill flow in flip-chip encapsulation |
| title_full |
Spatial analysis of underfill flow in flip-chip encapsulation |
| title_fullStr |
Spatial analysis of underfill flow in flip-chip encapsulation |
| title_full_unstemmed |
Spatial analysis of underfill flow in flip-chip encapsulation |
| title_sort |
spatial analysis of underfill flow in flip-chip encapsulation |
| publisher |
Emerald Group Holdings Ltd. |
| publishDate |
2023 |
| _version_ |
1806425829971853312 |
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13.222552 |